DRESDEN, Germany, August 20, 2024- ESMC - a joint venture between TSMC, Robert Bosch GmbH, Infineon Technologies AG and NXP Semiconductors N.V. - today held a groundbreaking ceremony to officially mark the initial phase of land preparation for its first semiconductor fab in Dresden, Germany. Together with our partners, Bosch, Infineon and NXP, we are [...]The post TSMC Joint Venture Breaks Ground on Dresden Fab appeared first on High-Performance Computing News Analysis | insideHPC.