Article 139VY Video: AMD’s next Generation GPU and High Bandwidth Memory Architecture

Video: AMD’s next Generation GPU and High Bandwidth Memory Architecture

by
Rich Brueckner
from High-Performance Computing News Analysis | insideHPC on (#139VY)
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"HBM is a new type of CPU/GPU memory ("RAM") that vertically stacks memory chips, like floors in a skyscraper. In doing so, it shortens your information commute. Those towers connect to the CPU or GPU through an ultra-fast interconnect called the "interposer." Several stacks of HBM are plugged into the interposer alongside a CPU or GPU, and that assembled module connects to a circuit board. Though these HBM stacks are not physically integrated with the CPU or GPU, they are so closely and quickly connected via the interposer that HBM's characteristics are nearly indistinguishable from on-chip integrated RAM."

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