Article 1B58S Call for Papers: 2016 Hot Interconnects Conference

Call for Papers: 2016 Hot Interconnects Conference

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from High-Performance Computing News Analysis | insideHPC on (#1B58S)
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The 2016 Hot Interconnects Conference has issued its Call for Papers. The event takes place August 24-26 at Huawei in Santa Clara, California. "Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, datacenters and Clouds."

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