Toshiba's latest BiCS flash is stacked 64 layers high
by from Techreport on (#1NP4T)
Toshiba is stacking its 3D flash ever higher. In tandem with Western Digital (who now owns former Toshiba partner SanDisk), the company announced its third generation of BiCS flash chips today. These new TLC NAND devices maintain the same 256-gigabit capacity as their predecessors, but they stack those bits across 64 layers instead of the 48 in the last generation of BiCS flash. In time, the company expects to use this technology to deliver 512 gigabits (64GB) on a single chip.
...