CoolIT Systems and STULZ Debut High Density Chip-to-Atmosphere Data Center Liquid Cooling
by Rich Brueckner from Inside HPC & AI News | High-Performance Computing & Artificial Intelligence on (#2381M)
In this video, CoolIT Systems CEO & CTO, Geoff Lyon, and STULZ ATS President, Joerg Desler, discuss high density Chip-to-Atmospherea data center liquid cooling solutions for organizations big or small. When integrated, CoolIT Systems' DCLCa solutions can capture 85% and more of the servers' heat directly into liquid. Complimenting DCLCa, STULZ precision air cooling products capture the balance of the lower density heat. A considerable benefit forms when the total heat energy from both systems is consolidated, transported outside and then dissipated or recaptured for reuse, to heat nearby buildings, for example.
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