Article 2381M CoolIT Systems and STULZ Debut High Density Chip-to-Atmosphere Data Center Liquid Cooling

CoolIT Systems and STULZ Debut High Density Chip-to-Atmosphere Data Center Liquid Cooling

by
Rich Brueckner
from High-Performance Computing News Analysis | insideHPC on (#2381M)
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In this video, CoolIT Systems CEO & CTO, Geoff Lyon, and STULZ ATS President, Joerg Desler, discuss high density Chip-to-Atmospherea data center liquid cooling solutions for organizations big or small. When integrated, CoolIT Systems' DCLCa solutions can capture 85% and more of the servers' heat directly into liquid. Complimenting DCLCa, STULZ precision air cooling products capture the balance of the lower density heat. A considerable benefit forms when the total heat energy from both systems is consolidated, transported outside and then dissipated or recaptured for reuse, to heat nearby buildings, for example.

The post CoolIT Systems and STULZ Debut High Density Chip-to-Atmosphere Data Center Liquid Cooling appeared first on insideHPC.

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