Article 2BYGT AMD touts Zen die size advantage at ISSCC

AMD touts Zen die size advantage at ISSCC

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AMD has had a tough time competing with Intel's CPUs over the last few years. The modular philosophy in AMD's construction-core processors could never find the type of integer-heavy parallel workloads it needed to shine. At the same time, Intel continually extended its consistent advantage in manufacturing technology every year, while pushing AMD out of the mobile and server markets almost entirely.

The red team claims it's now back and ready to compete in every CPU metric, including logic gate density. In a paper published as part of the International Solid-State Circuits Conference (ISSCC), the company claims that its ...

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