CoolIT Systems Issued U.S. Patent for Modular Heat-Transfer Solutions
by staff from High-Performance Computing News Analysis | insideHPC on (#2C2VQ)
"U.S. Patent 9,496,200 protects the invention of utilizing a modular, building block approach for datacenter cooling with direct contact liquid cooling," said Geoff Lyon CEO, CoolIT Systems. "CoolIT's commitment to developing and patenting unique solutions provides our customers with the assured competitive advantage they are looking for. The 60 patent milestone adds confirmation to CoolIT's leadership in developing innovative liquid cooling solutions for modern data centers."
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