Article 2C2VQ CoolIT Systems Issued U.S. Patent for Modular Heat-Transfer Solutions

CoolIT Systems Issued U.S. Patent for Modular Heat-Transfer Solutions

by
staff
from High-Performance Computing News Analysis | insideHPC on (#2C2VQ)
imgres-1.jpg

"U.S. Patent 9,496,200 protects the invention of utilizing a modular, building block approach for datacenter cooling with direct contact liquid cooling," said Geoff Lyon CEO, CoolIT Systems. "CoolIT's commitment to developing and patenting unique solutions provides our customers with the assured competitive advantage they are looking for. The 60 patent milestone adds confirmation to CoolIT's leadership in developing innovative liquid cooling solutions for modern data centers."

The post CoolIT Systems Issued U.S. Patent for Modular Heat-Transfer Solutions appeared first on insideHPC.

External Content
Source RSS or Atom Feed
Feed Location http://insidehpc.com/feed/
Feed Title High-Performance Computing News Analysis | insideHPC
Feed Link https://insidehpc.com/
Reply 0 comments