Toshiba prepares a 96-layer 3D NAND parfait
by from Techreport on (#2V6CV)
Toshiba's announcement of four-bit QLC NAND flash isn't the only big event in the realm of flash memory production today. The company has also let the world know that it's begun producing fourth-generation BiCS TLC 3D NAND silicon, developed in a joint venture with Western Digital. The new generation chips stack 96 layers in order to build 256 Gb (32 GB) packages.
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