Toshiba uses through-silicon vias to boost 3D NAND efficiency
by from Techreport on (#2W7D2)
When it comes to storage, we hardware enthusiasts tend to focus on faster, cheaper, and more reliable stuff. Enterprise buyers like those things, but companies with large data centers also like power efficiency. Toshiba's BiCS 3D TLC NAND flash memory with through-silicon via (TSV) technology claims to reduce power consumption for storage applications that must provide low latency, high throughput, and high IOPS per watt in applications like enterprise SSDs. To our knowledge, this is the first market-ready NAND flash product to use through-silicon vias in its structure.
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