Article 2XCXA Intel’s Xeon Scalable Processors Provide Cooling Challenges for HPC

Intel’s Xeon Scalable Processors Provide Cooling Challenges for HPC

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from High-Performance Computing News Analysis | insideHPC on (#2XCXA)
asetekliquidcooling-150x92.png

Unless you reduce node and rack density, the wattages of today's high-poweredCPUs and GPUs are simply no longer addressable with air cooling alone. Asetek explores how new processors, such as Intel's Xeon Scalable processors, often call for more than just air cooling. "The largest Xeon Phi direct-to-chip cooled system today is Oakforest-PACS system in Japan. The system is made up of 8,208 computational nodes using Asetek Direct-to-Chip liquid cooled Intel Xeon Phi high performance processors with Knights Landing architecture. It is the highest performing system in Japan and #7 on the Top500."

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