Purdue researchers find a groovy method for cooling stacked chips
by from Techreport on (#36KJR)
We've had the ability to stack chips and create multi-die packages for a while. Cooling powerful chips is a hard task, however, and so far multi-layer designs have primarily been used for low-power products like NAND flash chips. That might change in the near future. Researchers at Purdue University, working under a grant from DARPA, have developed a new way of cooling microprocessors using boiling dielectric fluid passing through micro-channels in the chips themselves.
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