Article 3CPZ4 Micron and Intel to continue joint development of 3D NAND Memory through 2019

Micron and Intel to continue joint development of 3D NAND Memory through 2019

by
Rich Brueckner
from High-Performance Computing News Analysis | insideHPC on (#3CPZ4)
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Today Micron and Intel announced an update to their successful NAND memory joint development partnership that has helped the companies develop and deliver industry-leading NAND technologies to market. "The companies have agreed to complete development of their third-generation of 3D NAND technology, which will be delivered toward the end of this year and extending into early 2019. Beyond that technology node, both companies will develop 3D NAND independently in order to better optimize the technology and products for their individual business needs."

The post Micron and Intel to continue joint development of 3D NAND Memory through 2019 appeared first on insideHPC.

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