Article 3V1NN Supermicro Steps up to HPC & AI Workloads at ISC 2018

Supermicro Steps up to HPC & AI Workloads at ISC 2018

by
Rich Brueckner
from High-Performance Computing News Analysis | insideHPC on (#3V1NN)
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In this video from ISC 2018, Perry Hayes and Martin Galle from Supermicro describe the company's latest innovations for HPC and AI workloads. "Supermicro delivers the industry's fastest, most powerful selection of HPC solutions offering even higher density compute clusters to deliver maximum parallel computing performance for any science and engineering, simulation, modeling, or analytics applications," said Charles Liang, president and CEO of Supermicro.

The post Supermicro Steps up to HPC & AI Workloads at ISC 2018 appeared first on insideHPC.

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