Article 46G2M Intel Lakefield Brings Its 3D Chip-Stacking Tech to Life

Intel Lakefield Brings Its 3D Chip-Stacking Tech to Life

by
Brian Barrett
from Feed: All Latest on (#46G2M)
Story ImageWeeks after introducing Foveros, its 3D logic stacking technology, Intel has shown off a motherboard that puts it to use.
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