Intel at IEDM: Stacking Nanoribbon Transistors and Other Bleeding Edge Research
by Arne Verheyde from Tomshardware on (#4WQ37)
Intel has describes some of the work it has presented at the IEDM 2019 conference. The work includes innovation in packaging beyond its Foveros and Co-EMIB technologies and the stacking of germanium nanoribbons on top of FinFETs.