Video: High-Performance Memory For AI And HPC

In this video, Frank Ferro from Rambus examines the current performance bottlenecks in HPC, drilling down into power and performance for different memory options. "HBM2E offers the capability to achieve tremendous memory bandwidth. Four HBM2E stacks connected to a processor will deliver over 1.6 TB/s of bandwidth. And with 3D stacking of memory, high bandwidth and high capacity can be achieved in an exceptionally small footprint. Further, by keeping data rates relatively low, and the memory close to the processor, overall system power is kept low."

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