Omni-Path HPC Interconnect Reemerges as Intel Spin-out with $20M Investment Round from Intel Capital, Others

Left for dead last year, Intel's Omni-Path Architecture (OPA) high performance fabric may come back to life with a Series A $20 million venture round involving Intel Capital, Downing Ventures and Chestnut Street Ventures that places OPA interconnect technology under the auspices of a spin-out start-up called Cornelis Networks. OPA was a much-promoted Intel effort [...]

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