Ensure 5G Systems Integrity by using Multiphysics Analysis of Chips, Packages, and Systems
The evolution of 5G systems is rooted in the consistently increasing need for more data. Whether the application is future medical systems, autonomous vehicles, smart cities, AR/VR, IoT, or standard mobile communications systems, all require an ever-increasing amount of data. For 5G systems to reliably work, the physical data pathways must be well understood and reliably designed. Whether the pathway is in the chip or the wireless channel, large amounts of data must seamlessly flow unimpeded. This presentation will discuss the various data paths in 5G systems and how Multiphysics analysis can help design these paths to allow for maximum data integrity.
Wade Smith, Manager, Application Engineering
Wade Smith is an Applications Engineer Manager at ANSYS, Inc. in the High Frequency Electromagnetics Division where he specializes in Signal Integrity applications via tools such as HFSS, SIwave and Q3D. Prior to joining ANSYS, Wade worked with Sciperio, Inc. where he conducted multiple projects including antenna, FSS, and wireless sensor applications using 3D Printed fabrication techniques and electronic textiles. Prior to Sciperio, Wade worked at Harris Corporation where he was involved in projects such as wireless sensor applications, high-speed data-rate systems, 3D embedded RF Filter designs, antennas, and SIP/MCM applications used in the miniaturization of Software Defined Radio systems. Wade has an M.S.E.E. from the University of Central Florida.