Article 5G9DM TYAN Uses 3rd Gen Intel Xeon Scalable Chips for AI and Cloud Data Centers

TYAN Uses 3rd Gen Intel Xeon Scalable Chips for AI and Cloud Data Centers

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from High-Performance Computing News Analysis | insideHPC on (#5G9DM)

Newark, Calif. - April 6, 2021 - TYAN, a server platform design manufacturer, and MiTAC Computing Technology Corporation subsidiary, today introduced the 3rd Gen Intel Xeon Scalable processor-based server platforms featuring built-in AI acceleration, enhanced security, and PCIe Gen4 support for the most demanding workloads in cloud, enterprise, AI and HPC fields. Thanks to new [...]

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