Article 67DGV TSMC Holds 3nm Chip Ceremony in Taiwan, 2nm on Way

TSMC Holds 3nm Chip Ceremony in Taiwan, 2nm on Way

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from High-Performance Computing News Analysis | insideHPC on (#67DGV)
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HSINCHU, Taiwan, R.O.C. - TSMC (TWSE: 2330, NYSE: TSM) held a 3 nanometer (3nm) volume production and capacity expansion ceremony on December 29 at its Fab 18 construction site in the Southern Taiwan Science Park (STSP), bringing together suppliers, construction partners, central and local government, the Taiwan Semiconductor Industry Association, and member of academia to witness an [...]

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