SK hynix Says It Has Developed First 12-Layer HBM3
by staff from High-Performance Computing News Analysis | insideHPC on (#6B011)
Seoul, April 20, 2023 - SK hynix Inc. announced today it has become the industry's first to develop 12-layer HBM3 product with a 24 gigabyte (GB) memory capacity, currently the largest in the industry, and said customers' performance evaluation of samples is underway. HBM (High Bandwidth Memory) is a high-performance memory that vertically interconnects multiple [...]
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