Article 6B011 SK hynix Says It Has Developed First 12-Layer HBM3

SK hynix Says It Has Developed First 12-Layer HBM3

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from High-Performance Computing News Analysis | insideHPC on (#6B011)
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Seoul, April 20, 2023 - SK hynix Inc. announced today it has become the industry's first to develop 12-layer HBM3 product with a 24 gigabyte (GB) memory capacity, currently the largest in the industry, and said customers' performance evaluation of samples is underway. HBM (High Bandwidth Memory) is a high-performance memory that vertically interconnects multiple [...]

The post SK hynix Says It Has Developed First 12-Layer HBM3 appeared first on High-Performance Computing News Analysis | insideHPC.

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