Article 6C31Q TSMC Adds Advanced Packaging Capacity to Meet Nvidia Demands: Report

TSMC Adds Advanced Packaging Capacity to Meet Nvidia Demands: Report

by
from Tomshardware on (#6C31Q)
Story ImageNvidia needs more CoWoS capacity to meet demand for its A100 and H100 compute GPUs. TSMC is expanding to accommodate those requirements.
External Content
Source RSS or Atom Feed
Feed Location https://www.tomshardware.com/feeds/all
Feed Title Tomshardware
Feed Link https://www.tomshardware.com/
Reply 0 comments