TSMC Opens Backend Fab 6 for Expansion of 3DFabric System Integration
by staff from High-Performance Computing News Analysis | insideHPC on (#6C445)
HSINCHU, Taiwan, R.O.C, Jun. 8, 2023-TSMC (TWSE: 2330, NYSE: TSM) today announced the opening of its Advanced Backend Fab 6, the company's first all-in-one automated advanced packaging and testing fab to realize 3DFabric integration of front-end to back-end process and testing services. The fab is prepared for mass production of TSMC-SoIC (System on Integrated Chips) [...]
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