Article 6J3T3 Intel opens $3.5 billion advanced Foveros 3D chip packaging facility in New Mexico

Intel opens $3.5 billion advanced Foveros 3D chip packaging facility in New Mexico

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from Tomshardware on (#6J3T3)
Story ImageIntel's Fab 9 that specializes on Foveros 3D packaging starts operations in New Mexico.
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