Article 6J92J The U.S. government will distribute $500 million from the CHIPS Act to fund R&D for packaging technology and a research institute

The U.S. government will distribute $500 million from the CHIPS Act to fund R&D for packaging technology and a research institute

by
mc@matthewconnatser.net (Matthew Connatser)
from Tomshardware on (#6J92J)
Story ImageThe Department of Commerce is signaling that it intends to distribute at least $500 million of CHIPS Act cash.
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