SK hynix reportedly planning for a $4 billion chip packaging facility in Indiana — for HBM and other exotic memory types
by from Tomshardware on (#6KMQC)
SK hynix plans to build a $4 billion chip packaging facility in Indiana, which could begin operations in 2029, according to a WSJ report. If the plant gets the green light, likely with tax incentives, it would focus on advanced packaging like that used for HBM3e and future HBM solutions.