U.S. in Preliminary $400M Deal with GlobalWafers to Build 300mm Silicon Wafer Fabs

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from Inside HPC & AI News | High-Performance Computing & Artificial Intelligence on 2024-07-18 15:19 (#6PAEB)

The U.S. Department of Commerce yesterday announced a proposed $400 million CHIPS + Science Act investment to build what the agency said would be the first domestic fab for 300mm silicon wafers and expand ....

The post U.S. in Preliminary $400M Deal with GlobalWafers to Build 300mm Silicon Wafer Fabs appeared first on High-Performance Computing News Analysis | insideHPC.

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