Amkor and TSMC team up for advanced packaging in the U.S. — CoWoS and InFo to make AI and HPC CPUs
by from Tomshardware on (#6R7TD)
Amkor will offer TSMC's advanced CoWoS and InFo chip packaging for AI and HPC processors in the U.S.Amkor will offer TSMC's advanced CoWoS and InFo chip packaging for AI and HPC processors in the U.S.