Amkor and TSMC Collaborate on Advanced Packaging in Arizona
by staff from High-Performance Computing News Analysis | insideHPC on (#6R7TR)
TEMPE, Ariz. and HSINCHU, Taiwan, R.O.C. Oct. 4, 2024 - TAMC and Amkor Technology announced today a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona. Under the agreement, TSMC will contract with Amkor's outsourced semiconductor assembly and test (OSAT) services, in their planned facility in Peoria, Arizona. TSMC will leverage [...]
The post Amkor and TSMC Collaborate on Advanced Packaging in Arizona appeared first on High-Performance Computing News Analysis | insideHPC.