Intel details next-gen 18A fab tech: significantly more performance, lower power, higher density
by ashilov@gmail.com (Anton Shilov) from Latest from Tom's Hardware on (#6WRP8)
At VLSI Symposium 2025, Intel will provide more details about its 18A process node featuring RibbonFET transistors and PowerVia backside power delivery that enable major improvements in power, performance, and area over Intel 3, with early interest from companies like Apple and Nvidia signaling potential third-party adoption.