Patent reveals Huawei's quad-chiplet rival for Nvidia's Rubin AI GPUs could use packaging tech that rivals TSMC — Ascend 910D rumors have seemingly solid foundation
by ashilov@gmail.com (Anton Shilov) from Latest from Tom's Hardware on (#6XZXE)
Huawei has reportedly developed a chip packaging process technology for its Ascend 910D processor that is comparable to TSMC's leading-edge CoWoS technology.