How TSMC managed to increase efficiency of ASML's EUV tools: System-level optimizations and in-house pellicles —chipmaker boosted EUV-driven wafer production by 30x over six years while reducing
by ashilov@gmail.com (Anton Shilov) from Latest from Tom's Hardware on (#703ET)
TSMC has dramatically boosted EUV scanner throughput, pellicle performance, and energy efficiency through deep in-house innovations.