'Beyond EUV' chipmaking tech pushes Soft X-Ray lithography closer to challenging Hyper-NA EUV — 'B-EUV' uses new resist chemistry to make smaller chips

Researchers at Johns Hopkins University have developed a new resist chemistry and deposition method optimized for 6.5nm B-EUV light, marking a key step toward future Soft X-ray lithography. However, major challenges like light sources and tool infrastructure remain unresolved.