Apple and Broadcom job listings suggest potential Intel Foundry collaborations — requirements highlight expertise in Intel's EMIB and 2.5D memory packaging tech
by editors@tomshardware.com (Aaron Klotz) from Latest from Tom's Hardware on (#71J97)
A new job posting at Apple exposes clues that the company could be looking at Intel as a packaging partner for future SoCs. Future M-series chips could leverage EMIB and/or Foveros.