Article 725D2 First truly 3D chip fabbed at US foundry, features carbon nanotube transistors and RAM on a single die — future devices could have up to 1000x improvement in energy-delay product

First truly 3D chip fabbed at US foundry, features carbon nanotube transistors and RAM on a single die — future devices could have up to 1000x improvement in energy-delay product

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Story ImageA collaborative research team has demonstrated what it says is the first monolithic 3D integrated circuit manufactured at a commercial U.S. foundry.
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