The data center cooling state of play (2025) — Liquid cooling is on the rise, thermal density demands skyrocket in AI data centers, and TSMC leads with direct-to-silicon solutions
by ashilov@gmail.com (Anton Shilov) from Latest from Tom's Hardware on (#726Q7)
The rise of AI and hyperscale computing is driving a global shift from air-based to liquid and embedded cooling as various companies are developing silicon-integrated systems capable of handling multi-kilowatt system-in-packages that can be commercialized by 2027.