Article 74RWN Intel reportedly in talks with Google and Amazon over advanced packaging — major customers could take advantage of EMIB-T later this year

Intel reportedly in talks with Google and Amazon over advanced packaging — major customers could take advantage of EMIB-T later this year

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from Latest from Tom's Hardware on (#74RWN)
Story ImageIntel is understood to be in active talks with Google and Amazon to provide advanced chip packaging services for their custom AI ASICs.
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