Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, in
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Huawei Technologies unveiled a new LogicFolding" chip design framework built on its proprietary Tau scaling law, claiming it can dramatically boost transistor density and power efficiency without EUV lithography - potentially helping China narrow the gap with TSMC and Nvidia despite U.S. sanctions.