Chinese fab SMIC's 7nm metal pitch beats Intel 18A but lags 38% on density, teardown finds — Huawei's sanctions-beating HiSilicon Kirin 9030 is the first subject of SemiAnalysis's new teardown l

SemiAnalysis has published the first teardown from its new in-house lab, focusing on the minimum local metal pitch on SMIC's third-gen 7nm at 32.5nm.