Samsung begins mass production of 4GB HBM2 memory chips
by from Techreport on (#113W9)
Just under a week ago, JEDEC updated the High-Bandwidth Memory standard with provisions for bigger, faster memory packages. Hot on JEDEC's heels, Samsung has taken the wraps off its mass-production 4GB HBM2 chips this evening.
The company says it's fabricating these 4GB dies on its 20-nm process. Each of these packages comprises four 8Gb core dies atop a buffer die at the base of the stack. Consistent with JEDEC's specifications, each of these HBM2 dies will offer 256 GB/s of bandwidth. For comparison, Samsung says that ...