Article 175S8 Mellanox & Cadence Demonstrate PCI Express 4.0 Multi-Lane PHY IP Interoperability

Mellanox & Cadence Demonstrate PCI Express 4.0 Multi-Lane PHY IP Interoperability

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from High-Performance Computing News Analysis | insideHPC on (#175S8)
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Today Cadence announced a collaboration with Mellanox Technologies to demonstrate multi-lane interoperability between Mellanox's physical interface (PHY) IP for PCIe 4.0 technology and Cadence's 16Gbps multi-link and multi-protocol PHY IP implemented in TSMC's 16nm FinFET Plus (16FF+) process. Customers seeking to develop and deploy next-generation green data centers can now use a silicon-proven IP solution from Cadence for immediate integration and fastest market deployment. Cadence and Mellanox are scheduled to demonstrate electrical interoperability for PCIe 4.0 architecture between their respective PHY solutions at the 2016 TSMC Symposium on March 15, 2016 in Santa Clara, California.

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