Asetek Liquid Cooling Solution Coming to HPC Center

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from Inside HPC & AI News | High-Performance Computing & Artificial Intelligence on 2017-03-27 18:47 (#2H8KA)

Today Asetek announced a new order from one of its existing OEM partners for its RackCDU D2C (Direct-to-Chip) liquid cooling solution. The order is part of a new installation for an undisclosed HPC customer. "I am very pleased with the progress we are making in our emerging data center business segment," said Andri(C) Sloth Eriksen, CEO and founder of Asetek. "This repeat order, from one of our OEM partners, to a new end customer confirms the trust in our unique liquid cooling solutions and that adoption is growing."

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