Article 35YN1 Purdue Develops Intrachip Micro-cooling for HPC

Purdue Develops Intrachip Micro-cooling for HPC

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from High-Performance Computing News Analysis | insideHPC on (#35YN1)
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"I think for the first time we have shown a proof of concept for embedded cooling for Department of Defense and potential commercial applications," Garimella said. "This transformative approach has great promise for use in radar electronics, as well as in high-performance supercomputers. In this paper, we have demonstrated the technology and the unprecedented performance it provides."

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