Asetek Announces NEC as New Datacenter OEM Partner

Today Asetek announced NEC Corporation as a new data center OEM partner. NEC Corporation, through its subsidiary NEC Fielding, Ltd., will deploy Asetek RackCDU Direct-to-Chip liquid cooling at a new HPC installation in Japan. Asetek has already begun to make shipments in support of this installation. "Liquid cooling technology is becoming a key supercomputer component. Asetek's direct-to-chip technology enables more effective cooling and increased computational performance in high density HPC clusters, adding value for our end-users," said Noritaka HOSHI, (Senior Manager), NEC Corporation.

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