Intel delivers huge bandwidth boost to Stratix 10 MX FPGAs with EMIBs
Intel's Embedded Multi-Die Interconnect Bridge (EMIB) technology is one of the most interesting developments in package-level design this year. These tiny slices of silicon allow Intel to connect heterogeneous dice together on the same substrate without large interposers. Today, Intel revealed how it'll use EMIBs as part of the new Stratix 10 MX family of field-programmable gate arrays (FPGAs) to break through the challenges of feeding those accelerators with enough memory bandwidth. As it's doing with the HBM2 RAM on board the as-yet-unnamed marriage of an Intel CPU and Radeon graphics, Intel will use EMIBs to hook up Stratix 10 MX FPGAs to as many as four "tiles" of HBM2 RAM for aggregate bandwidth of up to 512 GB/s. Besides the HBM2 memory stacks, Intel is also using EMIBs to join four transceivers to the FPGA fabric for signals like PCIe.
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