Article 3JBJD Asetek Announces Ongoing Collaboration with Intel on Liquid Cooling for Servers and Datacenters

Asetek Announces Ongoing Collaboration with Intel on Liquid Cooling for Servers and Datacenters

by
Rich Brueckner
from High-Performance Computing News Analysis | insideHPC on (#3JBJD)
asetek-150x150.jpg

In anticipation of forthcoming product announcements, Asetek today announced an ongoing collaboration with Intel to provide hot water liquid cooling for servers and datacenters. This collaboration, which includes Asetek's ServerLSL and RackCDU D2C technologies, is focused on the liquid cooling of density-optimized Intel Compute Modules supporting high-performance Intel Xeon Scalable processors.

The post Asetek Announces Ongoing Collaboration with Intel on Liquid Cooling for Servers and Datacenters appeared first on insideHPC.

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