Asus’ wafer-thin ZenBook Pro 15 tames Core i9 and GTX 1050 power
by from Techreport on (#3Q71H)
Intel's Coffee Lake six-core mobile CPUs deliver a lot of performance in power envelopes up to 45 W. Most manufacturers go one step further and combine that power efficiency with fairly hefty cooling solutions and chassis. Asus says the three heat pipes and pair of fans in its ZenBook Pro 15 notebook allow the laptop to flex its available six-core muscles at speeds up to 4.5 GHz in an aluminum unibody chassis that's less than 0.75" (1.9 cm) thick.
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