Announcing the next generation of Intel® Omni-Path fabric, Intel® OPA200

In this video from ISC 2018, Joe Yaworski from Intel describes how the newly announced Intel(R) Omni-Path fabric, Intel(R) OPA200 interconnect will speed up HPC and AI applications. "Intel shared at ISC its next-generation Omni-Path Architecture (Intel(R) OPA200), coming in 2019, which will provide data rate speeds up to 200 Gb/s, doubling the performance of the previous generation. This next-generation fabric will be interoperable and compatible with the current generation of Intel(R) OPA. Intel(R) OPA200's high-performance capabilities and low-latency at scale will provide system architects the ability to scale to tens of thousands of nodes while benefiting from improved total cost of ownership."

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