SK Hynix officially launches its 96-layer 3D TLC NAND
by from Techreport on (#42ABW)
As traditional silicon scaling has stopped paying dividends for flash-storage density, NAND makers have packed more and more bits into their flash packages by layering more and more sheets of flash memory on top of one another. Today, SK Hynix is joining the elite 96-layer club with its "CTF-based 4D NAND flash." While that "4D" descriptor is purely fluff, the company is in fact producing many-layered charge-trap NAND (as opposed to the floating-gate tech favored by Intel and Micron). Those 96-layer stacks allow the company to pack 512 Gb (64 GB) of TLC flash into a single memory chip.
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