Plug and Play Liquid Cooling for AI and HPC
by staff from High-Performance Computing News Analysis | insideHPC on (#43YTP)
Cutting edge AI and HPC clusters require the highest performance versions of the latest CPUs and GPUs. Coming along with the throughput, these components bring high heat loads. Often, liquid cooling becomes a requirement in these circumstances. This sponsored post from Asetek explores how increasing AI and HPC workloads, as well as accompanying components like CPUs and GPUs, are heating up computing and bringing liquid cooling to the forefront.
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